Ensuring the heat is uniform across the BGA chip and the PCB. Reflow: The final spike where the solder actually melts. Cooling: A controlled ramp down to prevent thermal shock. Troubleshooting Common Issues "Communication Error"
Explain how to if your readings seem off? achi ir6500 software
: If your manual thermometer differs from the software display, use the SC (Sensor Correction) setting to input an offset (e.g., -8°C if the software reads too high). #95 | IR6500 Rework Station Software (PC410 Controller) Ensuring the heat is uniform across the BGA chip and the PCB